India signs MoU with Intel and 3DGS for glass-core substrate facility

Source:DigiTimes

02 — Who / Subject

Government of India, Intel, 3DGS

03 — Where / Locus

Odisha, India

04 — When / Temporality

May 30, 2026

Verified: May 30, 2026

05 — Why / Core Summary

"India signed an MoU with Intel and 3DGS to establish a glass-core substrate manufacturing facility. The facility will be located in the state of Odisha."

Conflict Analysis

Significant investment in semiconductor infrastructure in India.

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COMPAMIR

COMPAMIR

India signs MoU with Intel and 3DGS for glass-core substrate facility