Odisha, Intel and 3D Glass Solutions Inc. sign agreement for semiconductor facility

Source:The Economic Times

02 — Who / Subject

Government of Odisha, Intel, 3D Glass Solutions Inc.

03 — Where / Locus

Bhubaneswar-Khurda, India

04 — When / Temporality

May 29, 2026

Verified: May 29, 2026

05 — Why / Core Summary

"Odisha, Intel, and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. The project involves a $3.3 billion investment in the Bhubaneswar-Khurda region."

Conflict Analysis

A significant investment project under the India Semiconductor Mission, likely to have a major impact on the regional economy.

Recommended Background Resource

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Chip War: The Fight for the World's Most Critical Technology

Author: Chris Miller

This book provides a comprehensive history of the semiconductor industry and explains why advanced packaging and substrate technologies are the new frontier in the global race for chip supremacy, contextualizing India's strategic push into this sector.

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